焊接学报 >

2021 , Vol. 42 >Issue 1: 1 - 7

DOI: https://doi.org/10.12073/j.hjxb.20200809001

高通量方法在钎焊领域的应用现状

  • 王星星 ,
  • 何鹏 ,
  • 李帅 ,
  • 张墅野 ,
  • 骆静宜 ,
  • 佐藤 裕
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  • 1. 华北水利水电大学，河南省高效特种绿色焊接国际联合实验室，郑州，450045;
    2. 哈尔滨工业大学，先进焊接与连接国家重点实验室，哈尔滨，150001;
    3. 金华市金钟焊接材料有限公司，金华，321016;
    4. 日本东北大学，日本，仙台，980-8579
王星星，博士，副教授；主要从事特种钎焊材料设计、新材料及异种材料连接教学和科研工作；Email：paperwxx@126.com.

收稿日期: 2020-08-09

  网络出版日期: 2021-04-06

基金资助

国家自然科学基金资助项目(52071165)；河南省优秀青年科学基金项目(202300410268)；中国博士后基金面上资助项目(2019M662011)；新型钎焊材料与技术国家重点实验室开放课题(SKLABFMT201901)；先进焊接与连接国家重点实验室开放课题(AWJ-21M11).

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Application of high-throughput methods in the field of brazing

  • WANG Xingxing ,
  • HE Peng ,
  • LI Shuai ,
  • ZHANG Shuye ,
  • LUO Jingyi ,
  • SATO Yutaka
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  • 1. Henan International Joint Laboratory of High-efficiency Special Green Welding, North China University of Water Resources and Electric Power, Zhengzhou, 450045, China;
    2. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China;
    3. Jinhua Jinzhong Welding Materials Co. Ltd., Jinhua, 321016, China;
    4. Tohoku University, Sendai, 980-8579, Japan

Received date: 2020-08-09

  Online published: 2021-04-06

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摘要

高通量方法作为“材料基因组技术”三大核心要素之一，在材料成分设计、组织分析、性能优化、过程模拟等方面起着关键性作用. 钎焊技术作为焊接与连接领域的重要分支之一，是现代制造业中材料连接应用最广的方式. 首先对高通量方法在钎焊领域的应用研究进行概述，其次主要对近5年有关高通量制备钎料、软钎焊和硬钎焊领域高通量计算方面的最新研究进行高度归纳、总结，最后提出了目前钎焊基因工程研究的局限性，特别是高通量方法与钎焊技术有机组合方面存在的不足之处，同时指明了高通量方法在钎焊领域应用研究发展的方向，为未来实现钎焊4.0、智能钎焊工厂等提供技术支撑和参考信息.

关键词： 钎焊基因工程; 高通量方法; 分子动力学; 第一性原理

本文引用格式

王星星 , 何鹏 , 李帅 , 张墅野 , 骆静宜 , 佐藤 裕 . 高通量方法在钎焊领域的应用现状[J]. 焊接学报, 2021 , 42(1) : 1 -7 . DOI: 10.12073/j.hjxb.20200809001

Abstract

As one of the three major elements of “material genome technology”, high-throughput methods play a key role in material composition design, microstructure analysis, performance optimization, and process simulation. As one of the important branches in the field of welding and joining, brazing technology is the most widely used connection method in modern manufacturing industry. This article first summarizes the application research of the high-throughput method in the field of brazing, and secondly focuses on the latest research reports on high-throughput preparation of braze, high-throughput calculation in the field of soldering and brazing in the past 5 years. Finally, the limitations of current brazing genetic engineering research, especially the shortcomings in the effective combination of high-throughput methods and brazing technology, are put forward. Meanwhile, the research and development direction of high-throughput methods in the field of brazing is pointed out, providing technical support and reference information for the realization of brazing 4.0 and intelligent brazing factory in the future.

Key words： brazing genetic engineering; high-throughput methods; molecular dynamics; first-principles

参考文献

[1] 王海舟, 汪洪, 丁洪, 等. 材料的高通量制备与表征技术[J]. 科技导报, 2015, 33(10): 31-49
Wang Haizhou, Wang Hong, Ding Hong, et al. Progress in high-throughput materials synthesis and characterization[J]. Science & Technology Review, 2015, 33(10): 31-49
[2] 赵继成. 材料基因组计划中的高通量实验方法[J]. 科学通报, 2013, 58(35): 3647-3655
Zhao Jicheng. High-throughput experimental tools for the materials genome initiative (in Chinese)[J]. China Science Bull (Chin Ver), 2013, 58(35): 3647-3655
[3] Zhang Y, Guo J M, Chen J H. On the stacking fault energy related deformation mechanism of nano crystalline Cu and Cu alloys: a first-principles and TEM study[J]. Journal of Alloys and Compounds, 2019, 776: 807-818.
[4] 孙巧艳, 杜勇, 刘立斌, 等. 高性能钛合金的关键“基因”及高通量实验与计算技术的应用[J]. 中国材料进展, 2018, 37(4): 297-303
Sun Qiaoyan, Du Yong, Liu Libin, et al. Key material genome of titanium alloys and application of high-throughput experiment and computation[J]. Materials China, 2018, 37(4): 297-303
[5] 向勇, 闫宗楷, 朱焱麟, 等. 材料基因组技术前沿进展[J]. 电 子科技大学学报, 2016, 45(4): 634-649
Xiang Yong, Yan Zongkai, Zhu Yilin, et al. Progress on materials genome technology[J]. Journal of University of Electronic Science and Technology of China, 2016, 45(4): 634-649
[6] 何鹏, 林盼盼. 基于材料基因组理念的钎焊材料开发与智能钎焊技术创新系统工程[J]. 材料导报, 2019, 33 (1): 156-161
He Peng, Lin Panpan. The Systematic project involving brazes development and intelligent brazing technology innovation: a materials genome perspective[J]. Materials Reports, 2019, 33 (1): 156-161
[7] SEKULIć D P. Modeling of the sequence of phenomena in brazing[C]//Advances in Brazing: Science, Technology and Applications, Wood head Publishing Series in Welding and Other Joining Technologies, 2013: 55-81.
[8] 何鹏, 张玲. 智能钎焊技术进展[J]. 焊接学报, 2017, 38(4): 124-128
He Peng, Zhang Lin. Development of intelligent brazing technology[J]. Transactions of the China Welding Institution, 2017, 38(4): 124-128
[9] 李红, 袁俊丽, 栗卓新, 等. 纳米连接过程的分子动力学模拟研究进展[J]. 中国机械工程, 2019, 30(4): 486-493
Li Hong, Yuan Junli, Li Zhuoxin, et al. Process of molecular dynamics simulation of nanojoining processes[J]. China Mechanical Engineering, 2019, 30(4): 486-493
[10] Swiler T P, Hoehman R E. Molecular dynamics simulations of reactive wetting in metal–ceramic systems[J]. Acta Materialia, 2000, 48: 4419-4424.
[11] 陈永泰, 谢明, 胡洁琼, 等. 一种三元扩散偶高通量制备和热处理方法: 中国, 201910794666.1[P]. 2019-8-27.
Chen Yongtai, Xie Ming, Hu Jieqiong, et al. A high-throughput preparation and heat treatment method of Ternary diffusion couple: CN Patent, 201910794666.1[P]. 2019-8-27.
[12] 陈永泰, 谢明, 王松, 等. Ag-6Cu-1Zn-0.5Ni合金变形行为的高通量研究[J]. 贵金属, 2019, 40(S1): 35-39
Chen Yongtai, Xie Ming, Wang Song, et al. High throughput study on deformation behavior of Ag-6Cu-1Zn-0.5Ni alloy[J]. Precious Metals, 2019, 40(S1): 35-39
[13] Yang J, Zheng Y, Huang J H, et al. First-principles calculations on wetting interface between Ag-Cu-Ti fillermetal and SiC ceramic: Ag (111)/SiC(111) interface and Ag(111)/TiC(111) interface[J]. Applied Surface Science, 2018, 462: 55-64.
[14] 王国超. Cu-Ag-Ti2AlC钎焊体系结构稳定性及其连接机理研究[D]. 哈尔滨: 哈尔滨工业大学博士学位论文, 2015.
Wang Guochao. Research on structural stability and joining mechanism of Cu-Ag-Ti2AlC brazing system[D]. Harbin: Dissertation for the Doctoral Degree in Engineering: Harbin Institute of Technology, 2015.
[15] Hartz-behrend K, Bach F W, M Hwald K, et al. Classical molecular dynamics simulations (MD) of wetting phenomena in brazing processes[R]. Aachen: DVS-BER ICHTE, 2014.
[16] Zhang J, Xu Q, Hu Y L, et al. Interfacial bonding mechanism and adhesive transfer of brazed diamond with Ni-based filler alloy: First-principles and experimental perspective[J]. Carbon, 2019, 153: 104-115.
[17] Yang J, Huang J H, Zheng Y, et al. First-principles calculations on structural energetics of Cu-Ti binary system intermetallic compounds in Ag-Cu-Ti and Cu-Ni-Ti active filler metals[J]. Ceramics International, 2017, 43: 7751-7761.
[18] 贾延东, 王刚, 易军, 等. 封装用高硅铝合金结构梯度材料高通量制备装置及方法: 中国, 201610287138.3[P]. 2016−5−4.
Jia Yandong, Wang Gang, Yi Jun, et al. Device and method for high-throughput preparation of structural gradient material of high silicon aluminum alloy for package: CN patent, 201610287138.3[P]. 2016−5−4.
[19] 韩雨彤. SiC陶瓷与Al基和Sn基钎料钎焊界面结合特性的模拟计算[D]. 哈尔滨: 哈尔滨工业大学硕士学位论文, 2016.
Han Yutong. A first principle calculation of Al based and Sn based solder with SiC ceramic interfacial bonding[D]. Harbin: Dissertation for the Master Degree in Engineering: Harbin Institute of Technology, 2016.
[20] 贾延东, 耿川, 王刚, 等. Sn-Zn-Cu焊料的高通量制备方法: 中国, 201910557829.4[P]. 2019−6−25.
Jia Yandong, Geng Chuan, Wang Gang, et al. High-throughput preparation of Sn-Zn-Cu solders: CN patent, 201910557829.4[P]. 2019−6−25.
[21] Gao F, Qu J M, Takemoto T. Additive qccupancy in the Cu6Sn5-based intermetallic compound between Sn-3.5Ag solder and Cu studied using a first-principles approach[J]. Journal of Electronic Materials, 2010, 39: 426-432.
[22] Pang X Y, Liu Z Q, Wang S Q, et al. First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu3Sn(010)[J]. Journal of Materials Science & Technology, 2010, 26(12): 1057-1062.
[23] Xing W Q, Yu X Y, Li H L, et al. Microstructure and mechanical properties of Sn-9Zn-xAl2O3 nanoparticles (x=0–1) lead-free solder alloy: first-principles calculation and experimental research[J]. Materials Science & Engineering A, 2016, 678: 252-259.
[24] Lu Y, Ma L, Li S Y, et al. Effect of Cu element addition on the interfacial behavior and mechanical properties of Sn9Zn-1Al2O3 soldering 6061 aluminum alloys: First-principle calculations and experimental research[J]. Journal of Alloys and Compounds, 2018, 765: 128-139.
[25] Chen J S, Ye C H, Yu C, et al. The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints[J]. Computational Materials Science, 2015, 108: 1-7.
[26] Chen J S, Xu M J, Jin Y J, et al. Effect of electric field and Sn grain orientation on Cu consumption in Sn/Cu solder joint[J]. Computational Materials Science, 2014, 95: 166-171.
[27] 李红, 张续, 黄海新, 等. 钎焊过程数值模拟研究进展[J]. 北京工业大学学报, 2017, 43(6): 956-963
Li Hong, Zhang Xu, Huang Haixin, et al. Progress in the Numerical Simulation of Brazing Process[J]. Journal of Beijing University of Technology, 2017, 43(6): 956-963
[28] 倪雪辉, 罗辉庭, 叶剑辉. 铝合金换热器集流管隔板钎焊表面污染分析[J]. 压力容器, 2018, 35(8): 58-62
Ni Xuehui, Luo Huiting, Ye Jianhui. Analysis and prevention of surface pollution of aluminum alloy heat exchanger and baffle brazed surface[J]. Pressure Vessel Technology, 2018, 35(8): 58-62
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