Transient thermal simulation analysis method of missile-borne electronic equipment based on fluid-solid coupling

doi:10.3785/j.issn.1006-754X.2018.02.010

WANG Meng, XU Xiao-ting, LI Wen-qiang

Chinese?Journal?of?Engineering?Design ›› 2018, Vol. 25 ›› Issue (2) : 194-199,208.

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Chinese?Journal?of?Engineering?Design ›› 2018, Vol. 25 ›› Issue (2) : 194-199,208. DOI: 10.3785/j.issn.1006-754X.2018.02.010

Transient thermal simulation analysis method of missile-borne electronic equipment based on fluid-solid coupling

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 25(2): 194-199,208 https://doi.org/10.3785/j.issn.1006-754X.2018.02.010

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Received	Published
2017-07-05	2018-04-28
Issue Date
2019-07-16

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