Effects of surface state for Mo–Cu interlayer materials on interface bonding of multi-layer Cu/MoCu/Cu composites

SONG Peng, LI Da, HAN Ruirui, XIONG Ning, ZHANG Baohong, YAO Huilong

Powder Metallurgy Technology ›› 2023, Vol. 41 ›› Issue (3) : 249-254,262.

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Powder Metallurgy Technology ›› 2023, Vol. 41 ›› Issue (3) : 249-254,262. DOI: 10.19591/j.cnki.cn11-1974/tf.2023040007

Effects of surface state for Mo–Cu interlayer materials on interface bonding of multi-layer Cu/MoCu/Cu composites

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 41(3): 249-254,262 https://doi.org/10.19591/j.cnki.cn11-1974/tf.2023040007

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