焊锡接头冷热循环组织性能演化及失效机理
王冬梅, 刘广通, 有移亮, 张诚, 张伟
Microstructure and properties evolution and failure mechanism of solder joints after thermal cycling
WANG Dong-mei, LIU Guang-tong, YOU Yi-liang, ZHANG Cheng, ZHANG Wei
材料热处理学报
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2023, (1): 164
-171
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DOI: 10.13289/j.issn.1009-6264.2022-0254
