[1] A Hammoud, R L Patterson, S Gerber, et al. Electronic components and circuits for extreme temperature environments. 10th IEEE International Conference on Electronics, Sharjah, United Arab Emirates, December 14-17, 2003(1): 44-47.
[2] J Zhang, X F Sun, B B Zhang, et al. Effects of extreme temperature on the performance of electronic materials and components in deep space. Spacecraft Environment Engineering, 2018, 35(6): 547-554. (in Chinese)
[3] N Jiang, L Zhang, Z Q Liu, et al. Reliability issues of lead-free solder joints in electronic devices. Science and Technology of Advanced Materials, 2019, 20(1): 876-901.
[4] Y D Han, H Y Jing, L Y Xu, et al. Study on the Reliability of Sn-Ag-Cu Lead-free Solders. Electronics & Packaging, 2007, 7(3): 4-6. (in Chinese)
[5] R Ramesham. Reliability of Sn/Pb and lead-free (SnAgCu) solders of surface mounted miniaturized passive components for extreme temperature (-185℃ to +125℃) space missions. Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X, San Francisco, California, USA, February 18, 2011: 79280F.
[6] N Chen. Dynamic mechanical properties of lead free solders. Beijing: Beijing University of Technology, 2008. (in Chinese)
[7] R Rameshamf. Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185 ℃ to +125 ℃). Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, San Francisco, California, USA, February 4, 2010: 75920F.
[8] R Y Tian, C J Hang, Y H Tian, et al. Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes. Journal of Materials Processing Technology, 2019, 268: 1-9.
[9] C J Hang, R Y Tian, L Y Zhao, et al. Influence of interfacial intermetallic growth on the mechanical properties of Sn-37Pb solder joints under extreme temperature thermal shock. Applied Sciences, 2018, 8(11): 2056.
[10] K C R Abell, Y L Shen. Deformation induced phase rearrangement in near eutectic tin-lead alloy. Acta Materialia, 2002, 50(12): 3193-3204.
[11] K N Tu, K Zeng. Tin-lead (SnPb) solder reaction in flip chip technology. Materials Science and Engineering: R: Reports, 2001, 34(1): 1-58.
[12] A Lupinacci, A A Shapiro, J O Suh, et al. A study of solder alloy ductility for cryogenic applications. 2013 IEEE International Symposium on Advanced Packaging Materials, Irvine, CA, USA, February 27-March 1, 2013: 82-88.
[13] P Limaye, W Maurissen, K Lambrinou, et al. Low-temperature embrittlement of lead-free solders in joint level impact testing. 2007 9th Electronics Packaging Technology Conference, Singapore, December 10-12, 2007: 140-151.
[14] R Y Tian. Microstructure evolution and failure mechanism of Sn-based solder joints in extreme temperature environment. Harbin: Harbin Institute of Technology, 2019. (in Chinese)
[15] X L Ji, Q An, Y P Xia, et al. Maximum shear stress-controlled uniaxial tensile deformation and fracture mechanisms and constitutive relations of Sn-Pb eutectic alloy at cryogenic temperatures. Materials Science and Engineering: A, 2021, 819: 141523.
[16] Q An, C Q Wang, X X Zhao, et al. The mechanism study of low-temperature brittle fracture of bulk Sn-based solder. 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin, China, August 16-19, 2017: 1233-1237.
[17] J H Wang, S B Xue, Z P Lv, et al. Effect of gamma-ray irradiation on microstructure and mechanical property of Sn63Pb37 solder joints. Journal of Materials Science: Materials in Electronics, 2018, 29: 20726-20733.
[18] J H Wang, S B Xue, Z P Lv, et al. Study on the reliability of Sn50Pb49Sb1/Cu solder joints subjected to γ-ray irradiation. Applied Sciences, 2018, 8(10): 1706.
[19] A Wattanakornphaiboon, R Canyook, K Fakpan. Effect of SnO2 reinforcement on creep property of Sn-Ag-Cu solders. Materials Today: Proceedings, 2018, 5(3): 9213-9219.
[20] V M F Marques, B Wunderle, C Johnston, et al. Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature. Acta Materialia, 2013, 61(7): 2471-2480.
[21] A M Erer, S Oguz, Y Türen. Influence of bismuth (Bi) addition on wetting characteristics of Sn-3Ag-0.5Cu solder alloy on Cu substrate. Engineering Science and Technology, an International Journal, 2018, 21(6): 1159-1163.
[22] B Ali, M F M Sabri, S M Said, et al. Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. Microelectronics Reliability, 2018, 82: 171-178.
[23] A E Hammad, A A Ibrahiem. Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles. Microelectronics Reliability, 2017, 75: 187-194.
[24] A Sharma, B G Baek, J P Jung. Influence of La2O3 nanoparticle additions on microstructure, wetting, and tensile characteristics of Sn-Ag-Cu alloy. Materials & Design, 2015, 87: 370-379.
[25] K M Kumar, V Kripesh, A A O Tay. Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders. Journal of Alloys and Compounds, 2008, 450(1-2): 229-237.
[26] E Bradley, K Banerji. Effect of PCB finish on the reliability and wettability of ball grid array packages. 1995 Proceedings. 45th Electronic Components and Technology Conference, Las Vegas, NV, USA, May 21-24, 1995: 1028-1038.
[27] T Hirano, K Fukuda, K Ito, et al. Reliability of lead free solder joint by using chip size package. Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment, Denver, CO, USA, May 9, 2001: 285-289.
[28] A Syed. Reliability and Au embrittlement of lead free solders for BGA applications. Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, GA, USA, March 11-14, 2001: 143-147.
[29] S W R Lee, B H W Lui, Y H Kong, et al. Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders. Soldering and Surface Mount Technology, 2002, 14(3): 46-50.
[30] T T Mattila, V Vuorinen, J K Kivilahti, et al. Impact of printed wiring board coatings on the reliability of leadfree chip-scale package interconnections. Journal of Materials Research, 2004, 19(11): 3214-3223.
[31] X Y Li, F H Li, F Guo, et al. Effect of isothermal aging and thermal cycling on interfacial IMC growth and fracture behavior of SnAgCu/Cu joints. Journal of Electronic Materials, 2011, 40: 51-61.
[32] D A A Shnawah, M F B M Sabri, I A Badruddin, et al. A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints. Microelectronics International, 2012, 29(1): 47-57.
[33] X Y Niu, Z B Zhang, G X Wang, et al. Low silver lead-free solder joint reliability of VFBGA packages under board level drop test at -45℃. 2014 15th International Conference on Electronic Packaging Technology, Chengdu, China, August 12-15, 2014: 762-765.
[34] L Y Gao, Z Q Liu, C F Li. Failure mechanisms of SAC/Fe-Ni solder joints during thermal cycling. Journal of Electronic Materials. 2017, 46: 5338-5348.
[35] T T Mattila, V Vuorinen, J K Kivilahti. Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections. Journal of Materials Research, 2004, 19(11): 3214-3223.
[36] H T Chen, J Han, J Li, et al. Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing. Microelectronics Reliability, 2012, 52(6): 1112-1120.
[37] J B Chen, Y P Wu, B An. Effect of rapid thermal cycles on the microstructure of single solder joint. 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8-11, 2011: 1-4.
[38] R Y Tian, Y H Tian, C X Wang, et al. Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures. Materials Science and Engineering: A, 2017, 684: 697-705.
[39] J H L Pang, T H Low, B S Xiong, et al. Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength. Thin Solid Films, 2004, 462-463: 370-375.
[40] B Xiao. Investigation on mechanics behavior and microstructure evolution of tin-lead-silver solders and joints at extremely low temperature. Harbin: Harbin Institute of Technology, 2018. (in Chinese)
[41] X Li, Y Yao. Effect of Cryogenic treatment on mechanical properties and microstructure of solder joint. 2017 18th International Conference on Electronic Packaging Technology, Harbin, China, August 16-19, 2017: 1327-1330.
[42] Y R Y Li, G C Fu, B Wan, et al. Failure analysis of SAC305 ball grid array solder joint at extremely cryogenic temperature. Applied Sciences, 2020, 10(6): 1951.
[43] D S Liu, C L Hsu, C Y Kuo, et al. Effect of low temperature on the micro-impact fracture behavior of Sn-Ag-Cu solder joint. 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, China, October 20-22, 2010: 1-3.
[44] J A Babcock, J D Cressler, L S Vempati, et al. Ionizing radiation tolerance of high-performance SiGe HBTs grown by UHV/CVD. IEEE Transactions on Nuclear Science, 1995, 42(6): 1558-1566.
[45] J M Roldan, G F Niu, W E Ansley, et al. An investigation of the spatial location of proton-induced traps in SiGe HBTs. IEEE Transactions on Nuclear Science, 1998, 45(6): 2424-2429.
[46] S M Zhang, G F Niu, J D Cressler, et al. The effects of proton irradiation on the RF performance of SiGe HBTs. IEEE Transactions on Nuclear Science, 1999, 46(6): 1716-1721.
[47] A Y Polyakov, I H Lee. Deep traps in GaN-based structures as affecting the performance of GaN devices. Materials Science and Engineering: R: Reports, 2015, 94: 1-56.
[48] K A Son, A N Liao, G Lung, et al. GaN-based high temperature and radiation-hard electronics for harsh environments. Nanoscience and Nanotechnology Letters, 2010, 2(2): 89-95.
[49] A C V Boas, M A A de Melo, R B B Santos, et al. Ionizing radiation hardness tests of GaN HEMTs for harsh environments. Microelectronics Reliability, 2021, 116: 114000.
[50] M Bhatnagar, B J Baliga. Analysis of silicon carbide power device performance. Proceedings of the 3rd International Symposium on Power, Baltimore, MD, USA, April 22-24, 1991: 176-180.
[51] Y Tanaka, S Onoda, A Takatsuka, et al. Radiation hardness evaluation of SiC-BGSIT. Materials Science Forum, 2010, 645-648: 941-944.
[52] A A Lebedev, V V Kozlovski, K S Davydovskaya, et al. Radiation hardness of silicon carbide upon high-temperature electron and proton irradiation. Materials, 2021, 14(17): 4976.
[53] W Paulus, I A Rahman, A Jalar, et al. Effect of gamma radiation on micromechanical hardness of lead-free solder joint. AIP Conference Proceedings, 2015, 1678(1): 040018.
[54] W Y W Yusoff, N F N M Lehan, N S Sobri, et al. Influences of low dose gamma radiation on hardness and microstructure properties of green solder joint. Journal of Physics: Conference Series, 2021, 1816: 012118.
[55] L Wen, S B Xue, J H Wang, et al. Effects of γ-ray irradiation on microstructure and mechanical property of AuSn20 solder joint. Journal of Materials Science: Materials in Electronics, 2019, 30: 9489-9497.
[56] Y W Wang, C R Kao. Interfacial reactions of Cu and In for low-temperature processes. 2019 IEEE 21st Electronics Packaging Technology Conference, Singapore, December 4-6, 2019: 435-439.
[57] K K Xu, L Zhang, L L Gao, et al. Review of microstructure and properties of low temperature lead-free solder in electronic packaging. Science and Technology of Advanced Materials, 2020, 21(1): 689-711.
[58] X Cheng, C Liu, V V Silberschmidt. Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures. Computational Materials Science, 2012, 52(1): 274-281.
[59] R W Chang, F P McCluskey. Reliability assessment of indium solder for low temperature electronic packaging. Cryogenics, 2009, 49(11): 630-634.
[60] M Deshpande, R Chaudhari, P R Narayanan, et al. Evaluation of shear properties of indium solder alloys for cryogenic applications. Journal of Materials Engineering and Performance, 2021, 30(11): 7958-7966.
[61] H D Gui, R R Chen, J H Niu, et al. Review of Power Electronics Components at Cryogenic Temperatures. IEEE Transactions on Power Electronics, 2020, 35(5): 5144-5156.
[62] X Cheng, C Liu, V V Silberschmidt. Intermetallics formation and evolution in pure indium joint for cryogenic application. 2009 11th Electronics Packaging Technology Conference, Singapore, December 9-11, 2009: 562-566.
