YAN Huijiang, ZHANG Jianxin, BU Lijing, ZHU Chaogang, YANG Yong, CHU Zhenhua, DONG Yanchun, HE Jining, LIU Na
Four solder alloys of Sn-7.0Zn-xIn-3.8Bi-0.2Al (x=0, 4.5, 5.0, 5.5) were prepared by microalloying method. The influence of the In content on the microstructure, melting point, wettability, electrical conductivity, thermal conductivity of the solder alloys were studied, and compared with the performance of traditional pure In and Sn solders. The results show that the solder alloys consisted essentially of β-Sn and Zn-rich phases. The melting point of the solder alloys gradually decreased and the wettability, electrical conductivity, thermal conductivity increased with the increase of In content.The melting point and wettability of Sn-7.0Zn-5.0In-3.8Bi-0.2Al solder alloy were better than those of pure Sn solder and close to those of of pure In solder. The resistivity and thermal conductivity of the solder alloy were close to those of of pure Sn solder.It was confirmed that Sn-7.0Zn-5.0In-3.8Bi-0.2Al solder alloy was suitable for sputtering target bonding.