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Research Progress on Precious Metal Sputtering Target |
XU Yanting1,2, GUO Junmei1,2, WANG Chuanjun1,2, SHEN Yue1,2, GUAN Weiming1,2, WEN Ming1,2 |
1. State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Sino Platinum Metals Co., Ltd., Kunming 650106, China; 2. Kunming Institute of Precious Metals, Kunming 650106, China |
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Abstract Sputtering targets are the key raw materials for the preparation of thin films by magnetron sputtering, and their quality determines the performance of the sputtered thin films. Precious metal sputtering targets are widely used in the preparation of high-performance thin films because of their excellent physical and chemical properties. The research progress on the preparation methods, technical requirements and application of precious metal sputtering targets is reviewed. The development direction of high purity, large size, high utilization rate, and integrated development of target production and sputtering film is put forward.
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Received: 18 January 2021
Published: 23 August 2021
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[1] |
MASHAIEKHY J,SHAFIEIZADEH Z,NAHIDI H.Effect of substrate temperature and film thickness on the characteristics of silver thin films deposited by DC magnetron sputtering[J].The European Physical Journal (Applied Physics),2012,60(2):20301.
|
[2] |
TOLSTOVA Y,OMELCHENKO S T,SHING A M,et al.Heteroepitaxial growth of Pt and Au thin films on MgO single crystals by bias-assisted sputtering[J].Scientific Reports,2016,6:23232.
|
[3] |
孙振华,沈丽如.提高平面磁控溅射靶材利用率方法分析[J].真空,2016,53(4):11-13. SUN Z H,SHEN L R.Analysis of improving the utilization rate of sputtering target of planar magnetic[J].Vacuum,2016,53(4):11-13.
|
[4] |
张卫刚,李媛媛,孙旭东,等.平板显示行业用金属溅射靶材的市场需求分析[J].真空科学与技术学报,2018,38(9):821-824. ZHANG W G,LI Y Y,SUN X D,et al.Analysis of market demand and supply of sputtering target in flat-panel display industry[J].Chinese Journal of Vacuum Science and Technology,2018,38(9):821-824.
|
[5] |
迟伟光,张凤戈,王铁军,等.溅射靶材的应用及发展前景[J].新材料产业,2010(11):6-11. CHI W G,ZHANG F G,WANG T J,et al.Application and development prospects of sputtering targets[J].Advanced Materials Industry,2010(11):6-11.
|
[6] |
雷继锋.集成电路制造用溅射靶材绑定技术相关问题研究[J].金属功能材料,2013,20(1):48-53. LEI J F.Research on bonding technology of sputtering target for IC manufacturing process[J].Metallic Functional Materials,2013,20(1):48-53.
|
[7] |
何金江,陈明,朱晓光,等.高纯贵金属靶材在半导体制造中的应用与制备技术[J].贵金属,2013,34(增刊1):79-83. HE J J,CHEN M,ZHU X G,et al.Application and fabrication method of high purity precious metal sputtering targets used in semiconductor[J].Precious Metals,2013,34(S1):79-83.
|
[8] |
尚再艳,江轩,李勇军,等.集成电路制造用溅射靶材[J].稀有金属,2005,29(4):475-477. SHANG Z Y,JIANG X,LI Y J,et al.Sputtering targets used in integrated circuit[J].Chinese Journal of Rare Metals,2005,29(4):475-477.
|
[9] |
张勤,张俊凯,厉英.磁控溅射金基合金靶材的制备、应用及发展趋势[J].材料导报,2014,28(5):16-19. ZHANG Q,ZHANG J K,LI Y.Manufacture,application and trends of gold-base sputtering target alloys[J].Materials Review,2014,28(5):16-19.
|
[10] |
贾国斌,冯寅楠,贾英.磁控溅射用难熔金属靶材制作、应用与发展[J].金属功能材料,2016,23(6):48-52. JIA G B,FENG Y N,JIA Y.Manufacture,application and development of refractorymetal target used on magnetron sputtering[J].Metallic Functional Materials,2016,23(6):48-52.
|
[11] |
邓瑞,闻明,陈家林,等.钌粉提纯和钌靶制备的研究进展[J].贵金属,2019,40(1):82-87. DENG R,WEN M,CHEN J L,et al.Progress in refining of ruthenium powder and preparation of ruthenium target[J].Precious Metals,2019,40(1):82-87.
|
[12] |
何金江,万小勇,周辰,等.半导体用高利用率长寿命溅射靶材的研制[J].半导体技术,2014,39(1):71-77. HE J J,WAN X Y,ZHOU C,et al.Research and preparation of high utilization rate and long-life sputtering target used in semiconductor[J].Semiconductor Technology,2014,39(1):71-77.
|
[13] |
TEPMAN A. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity:US5320728[P].1994-6-14.
|
[14] |
杨邦朝,胡永达,崔红玲.溅射靶材的应用及发展趋势[J].真空,2002,39(1):1-4. YANG B C,HU Y D,CUI H L.Trend in development and applications of sputtering target materials[J].Vacuum,2002,39(1):1-4.
|
[15] |
罗俊锋.稀贵金属在磁记录靶材中的应用[J].中国科技信息,2011(18):50-50. LUO J F.Application of rare metals in magnetic recording targets[J].China Science and Technology Information,2011(18):50-50.
|
[16] |
张卫刚,李媛媛,孙旭东,等.半导体芯片行业用金属溅射靶材市场分析[J].世界有色金属,2018(10):1-3. ZHANG W G,LI Y Y,SUN X D,et al.Market analysis of metal sputtering target materials used in semiconductor chip industry[J].World Nonferrous Metals,2018(10):1-3.
|
[17] |
刘树峰,刘思德.等离子喷涂技术在溅射靶材制备中的应用[J].稀土信息,2018(4):32-35. LIU S F,LIU S D.Application of plasma spraying technology in the preparation of sputtering target[J].Rare Earth Information,2018(4):32-35.
|
[18] |
原範明,枪田聡明,松坂律也,等. 溅射靶材:1534110A[P]. 2004-10-06. HARA N, MATSUDA S, MATSUZAKA R, et al. Sputtering target:1534110A[P]. 2004-10-06.
|
[19] |
范亮,王欣平,董亭义.硬盘磁记录材料及其靶材制备技术[C]//第七届中国功能材料及其应用学术会议论文集.长沙:[出版者不详],2010:361-363. FAN L, WANG X P, DONG T Y. Hard disk magnetic recording materials and target preparation technology[C]//Proceedings of the 7th China Conference on Functional Materials and Applications. Changsha:[s.n.],2010:361-363.
|
[20] |
王一晴,闻明,郭俊梅,等.半导体工业用镍铂合金靶材的制备及结构研究[J].贵金属,2015,36(4):27-31. WANG Y Q,WEN M,GUO J M,et al.Preparation and structure of NiPt alloy target used in semiconductor industry[J].Precious Metals,2015,36(4):27-31.
|
[21] |
金永中,刘东亮,陈建.溅射靶材的制备及应用研究[J].四川理工学院学报(自然科学版),2005,18(3):22-24. JIN Y Z,LIU D L,CHEN J.Studying on manufacture and application of sputtering target materials[J].Journal of Sichuan University of Science & Engineering (Natural Science Edition),2005,18(3):22-24.
|
[22] |
李骥.RuTi基单层薄膜作为铜互连扩散阻挡层研究[D].上海:复旦大学,2010. LI J.Research on RuTi-based single-layer film as copper interconnection diffusion barrier[D].Shanghai:Fudan University,2010.
|
[23] |
陈松,耿永红,王传军,等.磁控溅射用CoCrPt系靶材制备技术研究进展[J].贵金属,2013,34(1):74-78. CHEN S,GENG Y H,WANG C J,et al.Research progress of CoCrPt system targets fabrication[J].Precious Metals,2013,34(1):74-78.
|
[24] |
张爱国,王荫君,韩秀峰,等.Cr/Ru/PtCo/Ru/PtCo/Ru介质中底层Ru厚度对磁记录特性影响的研究[J].物理学报,2005,54(4):1831-1835. ZHANG A G,WANG Y J,HAN X F,et al.Effect of thickness of the Ru under layer on the magneticrecording property of Cr/Ru/PtCo/Ru/PtCo/Ru media[J].Acta Physica Sinica,2005,54(4):1831-1835.
|
[25] |
王永明,吕超,夏乾坤.光记录用靶材的应用、性能要求和制造方法[J].材料导报,2012,26(增刊2):229-231. WANG Y M,LU C,XIA Q K.Applications,performance requirements and manufacturing methods of optical recording target[J].Materials Review,2012,26(S2):229-231.
|
[26] |
张广军,顾冬红,王阳,等.GeSbTe与AgInSbTe体系相变光盘的研究进展[J].物理,2004,33(5):345-350. ZHANG G J,GU D H,WANG Y,et al.Compact discs based on phase transformations in GeSbTe and AgInSbTe systems[J].Physics,2004,33(5):345-350.
|
[27] |
夏慧.薄膜与贵金属靶材[C]//TFC'03全国薄膜技术学术研讨会论文集.宁波:中国真空学会薄膜专业委员会,2003:126-128. XIA H. Film and precious metal targets[C]//Proceedings of TFC'03 National Thin Film Technology Symposium. Ningbo:Film Professional Committee of China Vacuum Society,2003:126-128.
|
[28] |
何金江,贺昕,熊晓东,等.集成电路用高纯金属材料及高性能溅射靶材制备研究进展[J].新材料产业,2015(9):47-52. HE J J,HE X,XIONG X D,et al.Research progress on preparation of high-purity metal materials and high-performance sputtering targets for integrated circuits[J].Advanced Materials Industry,2015(9):47-52.
|
[29] |
高岩,王兴权,吕保国,等.贵金属在新材料产业中的应用[C]//第十八届中国科协年会.西安:中国科协,2016:1-5. GAO Y, WANG X Q, LU B G, et al. Precious Metals Used in New Materials Industries[C]//18th Annual Meeting of China Association for Science and Technology. Xi'an:China Association for Science and Technology, 2016:1-5.
|
[30] |
尚维国,孙昊,郑云丰,等.银残靶材的熔炼回收工艺研究[J].铸造技术,2019,40(4):400-402. SHANG W G,SUN H,ZHENG Y F,et al.Study on smelting recovery process of residual silver target[J].Foundry Technology,2019,40(4):400-402.
|
[31] |
李丹之.掺杂半导体/金属膜系的光谱透射反射特性[J].物理学报,1999,48(12):2349-2356. LI D Z.Spectral transmission and reflection of the doping semiconductor/metal films systems[J].Acta Physica Sinica,1999,48(12):2349-2356.
|
[32] |
殷聪朋,管伟明,张俊敏,等.磁控溅射制备Ru-B薄膜的研究[J].贵金属,2013,34(2):5-9. YIN C P,GUAN W M,ZHANG J M,et al.Study of Ru-B films prepared by magnetron sputtering[J].Precious Metals,2013,34(2):5-9.
|
[33] |
LIU E Z, GUAN X R. Effect of Ru on corrosion resistance of high Cr content superalloy[J]. Materials and Corrosion, 2016, 67(12):1269-1273.
|
[34] |
CHEN Y I,CHANG L C,HUANG R T,et al.Internal oxidation of Mo-Ru coatings[J].Thin Solid Films,2010,518(14):3819-3824.
|
[35] |
CHEN Y I,LIU K T,WU F B,et al.Mo-Ru coatings on tungsten carbide by direct current magnetron sputtering[J].Thin Solid Films,2006,515(4):2207-2212.
|
[36] |
薛雅平,鞠洪博,陈敏,等.退火温度对磁控溅射Ru薄膜结构及膜基结合力的影响[J].金属热处理,2016,41(6):125-127. XUE Y P,JU H B,CHEN M,et al.Effect of annealing temperature on microstructure and adhesion strength of Ru films deposited by magnetron sputtering[J].Heat Treatment of Metals,2016,41(6):125-127.
|
[37] |
曹子宇,刘宇阳,桂涛,等.Ag-B靶材热压制备及致密化过程研究[J].稀有金属,2016,40(10):1038-1044. CAO Z Y,LIU Y Y,GUI T,et al.Preparation of Ag-B target by hot pressing and densification[J].Chinese Journal of Rare Metals,2016,40(10):1038-1044.
|
[38] |
谢贵久,陈云锋,谢锋,等.快速响应贵金属薄膜热电偶的研制[J].微处理机,2018,39(3):10-14. XIE G J,CHEN Y F,XIE F,et al.Research on rapid response precious metal thin film thermocouple[J].Microprocessors,2018,39(3):10-14.
|
[39] |
王鲁宁,闻明,张蕊,等.含金耐磨耐蚀涂层的制备及性能研究进展[J].贵金属,2019,40(1):75-81. WANG L N,WEN M,ZHANG R,et al.Preparation and properties research progress of wear and corrosion resistance coatings containing gold[J].Precious Metals,2019,40(1):75-81.
|
[40] |
樊涛.一种新型磁控溅射贵金属靶材设计[J].世界有色金属,2020(12):288-291. FAN T.Design of new noble metal magnetron sputtering target[J].World Nonferrous Metals,2020(12):288-291.
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